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1

Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au Content

Chuang, Tung-Han, Lin, Hsin-Jung, Wang, Hsi-Ching, Chuang, Chien-Hsun, Tsai, Chih-Hsin

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 1.87 MB

english, 2015

2

Evaluation of Corrosion Resistance of Ag-Alloy Bonding Wires for Electronic Packaging

Chen, Chun-Hao, Lin, Yan-Cheng, Shih, Yu-Ting, Chen, Sheng-Chi, Tsai, Chih-Hsin, Wang, Shang-Chih, Chuang, Tung-Han

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 1.79 MB

english, 2018

3

Culture-free detection of methicillin-resistant Staphylococcus aureus by using self-driving diffusometric DNA nanosensors

Wang, Jhih-Cheng, Tung, Yu-Ching, Ichiki, Keishi, Sakamoto, Hiroaki, Yang, Tai-Hua, Suye, Shin-ichiro, Chuang, Han-Sheng

Journal:

Biosensors and Bioelectronics

Year:

2019

Language:

english

File:

PDF, 3.03 MB

english, 2019

4

Interfacial microstructure and bonding strength of Sn–3Ag–0.5Cu and Sn–3Ag–0.5Cu–0.5Ce–xZn solder BGA packages with immersion Ag surface finish

Hsiu-Jen Lin, Tung-Han Chuang

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 1.83 MB

english, 2011

5

Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads

Chih-Chien Chi, Tung-Han Chuang

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 592 KB

english, 2006

6

Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads

Hui-Min Wu, Feng-Chih Wu, Tung-Han Chuang

Journal:

Journal of Electronic Materials

Year:

2005

Language:

english

File:

PDF, 732 KB

english, 2005

7

Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

Yu-Chih Liu, Wei-Hong Lin, Hsiu-Jen Lin, Tung-Han Chuang

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 516 KB

english, 2006

8

Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages

Tung-Han Chuang, Chih-Yuan Cheng, Tao-Chih Chang

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 587 KB

english, 2009

9

Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints

Hsiu-Jen Lin, Tung-Han Chuang

Journal:

Journal of Electronic Materials

Year:

2010

Language:

english

File:

PDF, 921 KB

english, 2010

10

Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints

Tung-Han Chuang, Hsing-Fei Wu

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 1.17 MB

english, 2011

11

Endoscopic Surgery for Intraventricular Hemorrhage (IVH) Caused by Thalamic Hemorrhage: Comparisons of Endoscopic Surgery and External Ventricular Drainage (EVD) Surgery

Chun-Chung Chen, Chun-Lin Liu, Ying-Nan Tung, Han-Chung Lee, Hao-Che Chuang, Shinn-Zong Lin, Der-Yang Cho

Journal:

World Neurosurgery

Year:

2011

Language:

english

File:

PDF, 866 KB

english, 2011

12

Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture

Jing-Yao Chang, Ren-Shin Cheng, Kuo-Shu Kao, Tao-Chih Chang, Tung-Han Chuang

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 2.67 MB

english, 2012

13

Formation and Growth of Intermetallics in an Annealing-Twinned Ag-8Au-3Pd Wire Bonding Package During Reliability Tests

Chuang, Tung-Han, Chang, Che-Cheng, Chuang, Chien-Hsun, Lee, Jun-Der, Tsai, Hsing-Hua

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1.42 MB

english, 2013

14

Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

Chang, Jing-Yao, Huang, Shin-Yi, Lee, Chang-Chun, Chuang, Tung-Han, Chang, Tao-Chih

Journal:

Journal of Electronic Packaging

Year:

2015

Language:

english

File:

PDF, 2.10 MB

english, 2015

15

Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wires

Kuo, Bing-Hau, Tsai, Du-Cheng, Huang, Yen-Lin, Hsu, Po-Chun, Chuang, Tung-Han, Tsai, Hsing-Hua, Shieu, Fuh-Sheng

Journal:

Metallurgical and Materials Transactions A

Year:

2018

Language:

english

File:

PDF, 4.07 MB

english, 2018

16

Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires

Chuang, Tung-Han, Chen, Chun-Hao

Journal:

Metallurgical and Materials Transactions A

Year:

2018

Language:

english

File:

PDF, 1.38 MB

english, 2018

17

SoberMotion

You, Chuang-Wen, Huang, Ming-Chyi, Shen, Ping-Hsuan, Tseng, Hsin-Tung, Wang, Hao-Chuan, Lin, Ya-Fang, Chuang, Yaliang, Lee, Ya-Han, Hsu, Pei-Yi, Lin, Shih-Yao, Chang, Chih-Chun, Chung, Yi-Ju, Chen, Yi

Journal:

Proceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies

Year:

2018

Language:

english

File:

PDF, 1.64 MB

english, 2018

18

Comparison of microstructural and optoelectronic properties of NiO:Cu thin films deposited by ion-beam assisted rf sputtering in different gas atmospheres

Wen, Chao-Kuang, Xin, Yan-Qing, Chen, Sheng-Chi, Chuang, Tung-Han, Chen, Pei-Jie, Sun, Hui

Journal:

Thin Solid Films

Year:

2019

Language:

english

File:

PDF, 1.79 MB

english, 2019

19

Bondability of Pd and Au containing Ag- alloy wires on Au pads for LED package

Yuan, Jui-Hung, Chuang, Tung-Han

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

Language:

english

File:

PDF, 1.19 MB

english, 2020

20

Study on thermoelectric property optimization of mixed-phase bismuth telluride thin films deposited by co-evaporation process

Wu, Yen-Ju, Hsu, Shih-Chieh, Lin, Ya-Cheng, Xu, Yibin, Chuang, Tung-Han, Chen, Sheng-Chi

Journal:

Surface and Coatings Technology

Year:

2020

File:

PDF, 1.42 MB

2020

21

Study of Charge Trapping Effects on AlGaN/GaN HEMTs under UV Illumination with Pulsed I-V Measurement

Nagarajan, Venkatesan, Chen, Kun-Ming, Chen, Bo-Yuan, Huang, Guo-Wei, Chuang, Chia-Wei, Lin, Chuang-Ju, Anandan, Deepak, Wu, Chai-Hsun, Han, Ping-Cheng, Singh, Sankalp Kumar, Luong, Tien-Tung, Chang,

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2020

File:

PDF, 1.04 MB

2020

22

Ultrasonic Bonding of Ag and Ag-Alloy RibbonâAn Innovative Alternative for High Power IC Packages

Chen, Chun-Hao, Lin, Yan-Cheng, Groth, Anne, Lai, Yu-Chang, Lin, Chia-Ying, Chang, Heng-Ming, Chuang, Tung-Han

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 4.37 MB

2020

23

Lattice buffer effect of Ti film on the epitaxial growth of Ag nanotwins on Si substrates with various orientations

Chuang, Tung-Han, Wu, Po-Ching, Lin, Yan-Cheng

Journal:

Materials Characterization

Year:

2020

File:

PDF, 6.47 MB

2020

24

Focused-Ion-Beam-Based Selective Closing and Opening of Anodic Alumina Nanochannels for the Growth of Nanowire Arrays Comprising Multiple Elements

Nai-Wei Liu, Chih-Yi Liu, Huai-Hsien Wang, Chen-Feng Hsu, Ming-Yu Lai, Tung-Han Chuang, Yuh-Lin Wang

Journal:

Advanced Materials

Year:

2008

Language:

english

File:

PDF, 285 KB

english, 2008

25

Polymeric fullerene oxide films produced by decomposition of hexanitro[60]fullerene

Run-Sheng Zhai, Arindam Das, Chien-Kui Hsu, Chau-Chung Han, Taizoon Canteenwala, Long Y Chiang, Tung J Chuang

Journal:

Year:

2004

Language:

english

File:

PDF, 385 KB

english, 2004

26

Deadzone compensation based on constrained RBF neural network

Chiung-Hsin Tsai, Han-Tung Chuang

Journal:

Journal of the Franklin Institute

Year:

2004

Language:

english

File:

PDF, 339 KB

english, 2004

27

Fuzzy control of pulsed GTA welds by using real-time root bead image feedback

Chiung-Hsin Tsai, Kuang-Hua Hou, Han-Tung Chuang

Journal:

Journal of Materials Processing Technology

Year:

2006

Language:

english

File:

PDF, 1.30 MB

english, 2006

28

Low-voltage organic thin-film transistors with polymeric nanocomposite dielectrics

Fang-Chung Chen, Chiao-Shun Chuang, Yung-Sheng Lin, Li-Jen Kung, Tung-Hsien Chen, Han-Ping D. Shieh

Journal:

Organic Electronics

Year:

2006

Language:

english

File:

PDF, 205 KB

english, 2006

29

Ultrasonic testing of artificial defects in alumina ceramic

Li-Shin Chang, Tung-Han Chuang

Journal:

Ceramics International

Year:

1997

Language:

english

File:

PDF, 675 KB

english, 1997

30

Erosion- and wear-corrosion behavior of Fe–Mn–Al alloys in NaCl solution

Her-Hsiung Huang, Tung-Han Chuang

Journal:

Materials Science and Engineering: A

Year:

2000

Language:

english

File:

PDF, 1.81 MB

english, 2000

31

Discontinuous coarsening of discontinuous precipitates in a Co–6 at.% Mo alloy

Shiu-Li Lee, Kuan-Ching Lee, Tung-Han Chuang

Journal:

Materials Science and Engineering: A

Year:

1998

Language:

english

File:

PDF, 690 KB

english, 1998

32

Intermetallic formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with immersion Ag surface finish

Tung-Han Chuang, Shiu-Fang Yen, Hui-Min Wu

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 765 KB

english, 2006

33

Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy

Shih-Ying Chang, Lung-Chuan Tsao, Tung-Han Chuang, Shiuan-Sheng Wang

Journal:

Metallurgical and Materials Transactions A

Year:

2003

Language:

english

File:

PDF, 1.86 MB

english, 2003

34

Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints

Tung-Han Chuang

Journal:

Metallurgical and Materials Transactions A

Year:

2007

Language:

english

File:

PDF, 561 KB

english, 2007

35

Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy

Tung-Han Chuang, Chao-Chi Jain

Journal:

Metallurgical and Materials Transactions A

Year:

2011

Language:

english

File:

PDF, 806 KB

english, 2011

36

Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes

Hsing-Fei Wu, Ming-Jui Chiang, Tung-Han Chuang

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 2.22 MB

english, 2004

37

Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3and Cu/Ti/Si with Sn/In interlayer

Tung-Han Chuang, Hsiu-Jen Lin, Cheng-Wen Tsao

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 188 KB

english, 2006

38

Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

Hsiu-Jen Lin, Tung-Han Chuang

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 865 KB

english, 2006

39

Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package

Tung-Han Chuang, Shiu-Fang Yen

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 403 KB

english, 2006

40

Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy

Tung-Han Chuang, Hsiu-Jen Lin, Chih-Chien Chi

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 555 KB

english, 2007

41

Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn

Tung-Han Chuang, Hsiu-Jen Lin

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 430 KB

english, 2009

42

The effect of 0.5 wt.% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads

Hsiu-Jen Lin, Tung-Han Chuang

Journal:

Materials Letters

Year:

2010

Language:

english

File:

PDF, 956 KB

english, 2010

43

Protein nitration is associated with increased proteolysis in skeletal muscle of bile duct ligation–induced cirrhotic rats

Ya-Yu Wang, Shih-Yi Lin, Yu-Han Chuang, Chia-Hung Mao, Kwong-Chung Tung, Wayne Huey-Herng Sheu

Journal:

Year:

2010

Language:

english

File:

PDF, 759 KB

english, 2010

44

Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints

Tung-Han Chuang

Journal:

Scripta Materialia

Year:

2006

Language:

english

File:

PDF, 292 KB

english, 2006

45

Clustered DNA methylation changes in polycomb target genes in early-stage liver cancer

Yao-Li Chen, Chih-Jan Ko, Ping-Yi Lin, Wan-Ling Chuang, Chia-Chen Hsu, Pei-Yi Chu, Mei-Yu Pai, Chun-Chun Chang, Ming-Han Kuo, Yi-Ru Chu, Chun-Hsin Tung, Tim H.-M. Huang, Yu-Wei Leu, Shu-Huei Hsiao

Journal:

Biochemical and Biophysical Research Communications

Year:

2012

Language:

english

File:

PDF, 1.09 MB

english, 2012

46

Effect of adding Ge on rapid whisker growth of Sn–3Ag–0.5Cu–0.5Ce alloy

Tung-Han Chuang, Chih-Chien Chi

Journal:

Journal of Alloys and Compounds

Year:

2009

Language:

english

File:

PDF, 2.33 MB

english, 2009

47

Electromigration of Sn–3Ag–0.5Cu and Sn–3Ag–0.5Cu–0.5Ce–0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads

Hsiu-Jen Lin, Jian-Shian Lin, Tung-Han Chuang

Journal:

Journal of Alloys and Compounds

Year:

2009

Language:

english

File:

PDF, 2.65 MB

english, 2009

48

Effect of La addition on the interfacial intermetallics and bonding strengths of Sn–58Bi solder joints with Au/Ni/Cu pads

Yu-Yun Shiue, Tung-Han Chuang

Journal:

Journal of Alloys and Compounds

Year:

2010

Language:

english

File:

PDF, 2.37 MB

english, 2010

49

Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn–3Ag–0.5Cu solder joints

Hsiu-Jen Lin, Tung-Han Chuang

Journal:

Journal of Alloys and Compounds

Year:

2010

Language:

english

File:

PDF, 2.43 MB

english, 2010

50

Influence of enamel wetness on composite restorations using various dentine bonding agents: Part II—effects on shear bond strength

Shu-Fen Chuang, Li-Tung Chang, Chih-Han Chang, Peter Yaman, Jia-Kuang Liu

Journal:

Journal of Dentistry

Year:

2006

Language:

english

File:

PDF, 446 KB

english, 2006

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